Method of manufacturing a data carrier

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package

Reexamination Certificate

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Details

C257S668000, C257S692000, C257S730000, C257S666000, C257S676000, C257S684000, C257S690000

Reexamination Certificate

active

10531365

ABSTRACT:
A method of manufacturing a data carrier from a support strip includes an overmoulding step, in which at least one support element of the support strip is overmoulded so as to obtain a data carrier body, and a microcircuit-connecting step, in which a microcircuit is electrically connected to the wiring pads of the data carrier body so as to obtain the data carrier.

REFERENCES:
patent: 4460825 (1984-07-01), Haghiri-Tehrani et al.
patent: 5041395 (1991-08-01), Steffen
patent: 5581065 (1996-12-01), Nishikawa et al.
patent: 6071758 (2000-06-01), Steffen
patent: 6641049 (2003-11-01), Luu
patent: 199 43 092-A 1 (2001-03-01), None
“GSM Technical Specification GSM 11.14 Version 5.7.0” European Telecommunication Standard, XX, XX, Apr. 1, 1998, p. COMPLETE66, XP002089350 the whole document.
International Search Report dated Apr. 19, 2004.

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