Method of manufacturing a connecting structure of printed wiring

Details Method of manufacturing a connecting structure of printed wiring Method of manufacturing a connecting structure of printed wiring

1996-05-24

1998-09-01

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29840, 1562733, 1562735, 1562755, 1562759, H05K 336

Patent

active

057993920

ABSTRACT:
A method of manufacturing a connecting structure of first and second printed wiring boards each having an electrode for conductively connecting to each other using a conductive film. A first printed wiring board with a resist film bonds to a second printed wiring board directly or using conductive film or bonding film. Both electrodes can be bonded using a conductive film and/or a bonding film. The resist film on one printed wiring board can be bonded to the electrode of another printed wiring board using a conductive film, or both resist films can be bonded using a conductive film.

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Kawaguchi, H., Nikkei Microdevices, Apr. 1995, pp. 137-139. (In Japanese).

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