Method of manufacturing a conductive micro bridge

Semiconductor device manufacturing: process – Having magnetic or ferroelectric component

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438619, H01L 2144, H01L 21465

Patent

active

056417098

ABSTRACT:
A method of manufacturing a conductive micro bridge includes the steps of preparing a semiconductor substrate, forming an insulating film on the semiconductor substrate, forming a sacrificial layer on the insulating film, forming a metal-oxide composite film on the sacrificial layer so as to surround the sacrificial layer, and removing the sacrificial layer to thereby form an air gap in the removed portion.

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patent: 5059556 (1991-10-01), Wilcoxen
patent: 5164339 (1992-11-01), Gimpelson
patent: 5270574 (1993-12-01), Boysel
patent: 5489556 (1996-02-01), Li et al.
patent: 5508231 (1996-04-01), Ball et al.

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