Method of manufacturing a compact optical semiconductor module c

Details Method of manufacturing a compact optical semiconductor module c Method of manufacturing a compact optical semiconductor module c

1993-10-21

1995-12-26

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437209, H01L 2144, H01L 2148

Patent

active

054787785

ABSTRACT:
In an optical semiconductor module having an optical semiconductor chip mounted on a substrate through a plurality of solder bumps each of which has a predetermined height and which is formed by molten solder, each of the bumps is surrounded by a side wall lower than the predetermined height of each bump. The optical semiconductor chip is precisely positioned on the substrate not only in a horizontal direction by self-alignment effect of the molten solder but also in a vertical direction due to shrinkage of the molten solder with a bottom surface of the optical semiconductor chip kept contact with upper surface of the side walls, upon cooling the molten solder.

REFERENCES:
patent: 4818728 (1989-04-01), Rai et al.
patent: 5001829 (1990-01-01), Schelborn
patent: 5134340 (1991-03-01), Haitz
patent: 5156997 (1992-10-01), Kumar et al.
patent: 5250469 (1993-10-01), Tanaka et al.
Katsura et al., "A Novel Flip-Chip Interconnection Technique Using Solder Bumps for High-Speed Photoreceivers", Journal of Lightwave Technology, vol. 8, No. 9, pp. 1323-1327, Sep. 1990.

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