Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2006-08-29
2009-10-20
Nguyen, Donghai D. (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S841000, C029S846000, C174S262000, C257S724000
Reexamination Certificate
active
07603771
ABSTRACT:
A method of providing at least two multilayer circuit boards, combining the at least two multilayer circuit boards to form a combined multilayer circuit board, and forming multiple outer conductive vias, circuits and contacts on the combined multilayer circuit board. Each multilayer circuit board is fabricated by the steps of preparing a single-layer printed circuit board having multiple chip sections, attaching at least one chip to the corresponding chip section, attaching a frame having multiple enclosures to the single-layer printed circuit board, attaching a semi-fluid glue sheet to the frame, vacuum pressing a conductive layer on the semi-fluid glue sheet and forming multiple conductive inner vias through the multilayer circuit board. The at least two multilayer circuit boards are combined by steps of reversing one of the multilayer circuit boards and vacuum pressing other multilayer circuit boards on the reversed multilayer circuit board.
REFERENCES:
patent: 5280192 (1994-01-01), Kryzaniwsky
patent: 6489685 (2002-12-01), Asahi et al.
patent: 7047634 (2006-05-01), Nakamura
Hershkovitz Abraham
Hershkovitz & Associates LLC
Mutual-Tek Industries Co., Ltd.
Nguyen Donghai D.
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