Method of manufacturing a coaxial trace in a surrounding...

Details Method of manufacturing a coaxial trace in a surrounding... Method of manufacturing a coaxial trace in a surrounding...

2008-07-22

2008-07-22

Lebentritt, Michael S. (Department: 2812)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

C438S042000, C438S456000, C438S700000, C257SE21122

Reexamination Certificate

active

11429292

ABSTRACT:
A method of manufacturing a coaxial trace (100) within a surrounding material (190) includes: providing a first substrate (191, 410) and a second substrate (192, 1010) composed of the surrounding material; forming a first portion (101, 601) of the coaxial trace in the first substrate; forming a second portion (102, 1001) of the coaxial trace in the second substrate; aligning the first portion of the coaxial trace with the second portion of the coaxial trace; and bonding the first portion of the coaxial trace to the second portion of the coaxial trace.

REFERENCES:
patent: 4602318 (1986-07-01), Lassen
patent: 2005/0136634 (2005-06-01), Savastiouk et al.

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