Method of manufacturing a circuit module

Details Method of manufacturing a circuit module Method of manufacturing a circuit module

1985-08-15

1987-01-13

Goldberg, Howard N.

Metal working

Method of mechanical manufacture

Electrical device making

29589, 357 80, H05K 330

Patent

active

046353569

ABSTRACT:
Terminal-equipped electronic elements, such as chip resistors and chip diodes, are arranged such that one surface of each terminal contacts one surface of a support board, the support board being placed to face a flat plate through a spacer. An electrically insulative liquid synthetic resin is injected between the support board and the flat board and cured to form a synthetic resin layer burying the electronic elements. The support board, flat board and spacer are peeled from the electronic elements and the synthetic resin layer to expose one surface of the terminal of each electronic element on one surface of the synthetic resin layer. A conductive pattern is formed on the synthetic resin layer by screen printing to connect the terminals of the electronic elements.

REFERENCES:
patent: 3430338 (1969-03-01), Flaherty
patent: 3570715 (1971-03-01), Barnes
patent: 3704515 (1972-12-01), Nelson
patent: 3905376 (1975-09-01), Johnson et al.
patent: 3992236 (1976-11-01), Wanesky

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