Method of manufacturing a circuit module

Details Method of manufacturing a circuit module Method of manufacturing a circuit module

1995-05-31

1996-11-05

Vo, Peter

Metal working

Method of mechanical manufacture

Electrical device making

29412, 29852, 22818021, 427 97, H05K 334

Patent

active

055705057

ABSTRACT:
A direct chip attach module (DCAM) 10, comprises of one or more electronic components 30, electrically bonded to a printed circuit 40, on a substrate 20. The DCAM 10, is bonded to an electronic circuit assembly by connection pads 50, formed on the edge of the DCAM substrate 10. This enables easy visual inspection of solder joints between the DCAM and the assembly.
DCAM substrates 10, are initially formed in a panel form 70, and vias 50, are drilled and filled with electrically conductive media 55, at predetermined connection points. The DCAM 10, is then excised from the parent panel 70, and the cut vias provide connection pads 55, along the edge of the substrate 10.

REFERENCES:
patent: 3597839 (1971-08-01), Jaccodine
patent: 4216523 (1980-08-01), Harford
patent: 4343084 (1982-08-01), Wilmarth
patent: 4790894 (1988-12-01), Homma et al.
patent: 4890383 (1990-01-01), Lumbard et al.
patent: 4898636 (1990-02-01), Rigling
patent: 4926546 (1990-05-01), Polczynski et al.
IBM Technical Disclosure Bulletin, vol. 35, No. 7, Dec. 1992, pp. 330-331, entitled "Module Interconnection Using Hybrid Attachment".

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