Cleaning and liquid contact with solids – Apparatus – With endless belt work conveyer
Reexamination Certificate
2006-12-05
2006-12-05
Perrin, Joseph L. (Department: 1746)
Cleaning and liquid contact with solids
Apparatus
With endless belt work conveyer
C134S133000, C134S184000, C134S902000
Reexamination Certificate
active
07143772
ABSTRACT:
It is possible to obtain a clean high-quality circuit board by removing affected material and foreign matter produced when a hole is formed. A manufacturing method of the circuit board includes (a) preparing a film-coated board material by bonding a film material as a mask to a board material, (b) forming a hole in the film-coated board material by applying a laser beam thereto, and (c) selectively removing the unnecessary material sticking to the film-coated board material from the film-coated board material by supersonic cleaning without peeling the film material off the board material. Unnecessary material such as foreign matter is produced when the hole is formed, and the unnecessary material sticks to the board material. After removal of such unnecessary material, a conductive material is disposed in the hole, using the film material as a mask, and the film material is later removed from the board material.
REFERENCES:
patent: 4635358 (1987-01-01), Fritz
patent: 4931134 (1990-06-01), Hatkevitz et al.
patent: 4964948 (1990-10-01), Reed
patent: 5145572 (1992-09-01), Hupe et al.
patent: 5203798 (1993-04-01), Watanabe et al.
patent: 5628926 (1997-05-01), Belgacem et al.
patent: 5666722 (1997-09-01), Tamm et al.
patent: 5709235 (1998-01-01), Akanuma et al.
patent: 5775350 (1998-07-01), Akanuma et al.
patent: 5836325 (1998-11-01), Akanuma et al.
patent: 5840402 (1998-11-01), Roberts et al.
patent: 5965043 (1999-10-01), Noddin et al.
patent: 6058950 (2000-05-01), Fujii et al.
patent: 6143401 (2000-11-01), Fischer et al.
patent: 0 329 807 (1989-08-01), None
patent: 0 568 930 (1993-11-01), None
patent: 01078799 (1989-03-01), None
patent: 01214093 (1989-08-01), None
patent: 01258488 (1989-10-01), None
patent: 6-268345 (1994-09-01), None
patent: 10224015 (1998-08-01), None
patent: 10-290072 (1998-10-01), None
Electronic translation of JP 10-224015.
Kishimoto Kunio
Miura Akihiro
Nakamura Shinji
Nishii Toshihiro
Takenaka Toshiaki
Matsushita Electric - Industrial Co., Ltd.
Perrin Joseph L.
LandOfFree
Method of manufacturing a circuit board and its... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of manufacturing a circuit board and its..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing a circuit board and its... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3719514