Method of manufacturing a circuit board

Details Method of manufacturing a circuit board Method of manufacturing a circuit board

2007-10-25

2010-10-12

Arbes, C. J (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S832000, C029S840000, C029S846000

Reexamination Certificate

active

07810232

ABSTRACT:
A printed circuit board and manufacturing method thereof. A printed circuit board has an insulation substrate, which includes an insulation layer, a circuit pattern formed on one side of the insulation layer, and an interlayer passage joined to the insulation layer and configured to electrically connect with the circuit pattern, and a heat-release layer, which is stacked on the other side of the insulation layer to be stacked on the insulation substrate, can provide a high heat-releasing effect and high bending strength, by means of inner layers or ground layers formed by the heat-release layers.

REFERENCES:
patent: 4938280 (1990-07-01), Clark
patent: 5239746 (1993-08-01), Goldman
patent: 5306670 (1994-04-01), Mowatt et al.
patent: 6032355 (2000-03-01), Tseng et al.
patent: 6163957 (2000-12-01), Jiang et al.
patent: 6265772 (2001-07-01), Yoshida
patent: 6326555 (2001-12-01), McCormack et al.
patent: 6442043 (2002-08-01), Seki
patent: 6739048 (2004-05-01), Jones
patent: 6820328 (2004-11-01), Barcley
patent: 6826830 (2004-12-01), Egitto et al.
patent: 6828510 (2004-12-01), Asai
patent: 6924987 (2005-08-01), Sugimoto
patent: 7279412 (2007-10-01), Mok et al.
patent: 7328505 (2008-02-01), Kondo
patent: 2005/0016764 (2005-01-01), Echigo et al.
patent: 2008/0052902 (2008-03-01), Kim et al.
patent: 2009/0064497 (2009-03-01), Mok et al.
patent: 7-86711 (1995-03-01), None
patent: 2001-94255 (2001-04-01), None
patent: 2001-168228 (2001-06-01), None
patent: 10-2001-076475 (2001-08-01), None
patent: 10-2001-0076475 (2001-08-01), None
U.S. Appl. No. 11/645,710, filed Dec. 27, 2006, Keun-Ho Kim et al, Samsung Electromechanics Co., LTD.
Japanese Patent Office Action, mailed Aug. 26, 2008 and issued in corresponding Japanese Patent Application No. 2006-347570.
U.S. Patent Office Action, Sep. 10, 2007, issued in corresponding U.S. Appl. No. 11/645,710.
U.S. Patent Office Action, Jan. 2, 2008, issued in corresponding U.S. Appl. No. 11/645,710.
U.S. Patent Office Action, May 13, 2008, issued in corresponding U.S. Appl. No. 11/645,710.
U.S. Patent Office Notice of Allowance, Oct. 2, 2008, issued in corresponding U.S. Appl. No. 11/645,710.
U.S. Patent Office Supplemental Notice of Allowance, Nov. 19, 2008, issued in corresponding U.S. Appl. No. 11/645,710.

Affiliated with

Also associated with

Rating

Method of manufacturing a circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing a circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing a circuit board will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4158966