Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2011-08-09
2011-08-09
Banks, Derris H (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S830000, C029S840000, C029S846000, C029S852000, C361S761000
Reexamination Certificate
active
07992291
ABSTRACT:
A method of manufacturing a circuit board, which includes a bump pad on which a solder bump may be placed, may include forming a solder pad on a surface of a first carrier; forming a metal film, which covers the solder pad and which extends to a bump pad forming region; forming a circuit layer and a circuit pattern, which are electrically connected with the metal film, on a surface of the first carrier; pressing the first carrier and an insulator such that a surface of the first carrier and the insulator faces each other; and removing the first carrier. Utilizing this method, the amount of solder for the contacting of a flip chip can be adjusted, and solder can be filled inside the board, so that after installing a chip, the overall thickness of the package can be reduced.
REFERENCES:
patent: 4855872 (1989-08-01), Wojnar et al.
patent: 4866841 (1989-09-01), Hubbard
patent: 5873161 (1999-02-01), Chen et al.
patent: 2004/0192023 (2004-09-01), Lee et al.
patent: 10-84186 (1998-03-01), None
patent: 10-154766 (1998-06-01), None
patent: 10-294339 (1998-11-01), None
Japanese Office Action dated Jun. 23, 2009 and issued in corresponding Japanese Patent Application 2007-274364.
Jung Hoe-Ku
Kang Myung-Sam
Kim Ji-Eun
Park Jeong-Woo
Park Jung-Hyun
Banks Derris H
Nguyen Tai
Samsung Electro-Mechanics Co. Ltd.
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