Method of manufacturing a card with a built-in electronic part,

Details Method of manufacturing a card with a built-in electronic part, Method of manufacturing a card with a built-in electronic part,

1996-02-27

1998-12-15

Kincaid, Kristine L.

Plastic and nonmetallic article shaping or treating: processes

With severing, removing material from preform mechanically,...

264496, B29C 3318

Patent

active

058492305

ABSTRACT:
A method of manufacturing a card with a built-in electronic part including a first step of mounting an electronic part, such as an LSI module, on a first bottom-covering material, applying a first molten resin onto the first bottom-covering material and the electronic part, and placing a first top-covering material on the fist molten resin. A second step includes curing the first molten resin, thereby forming a first structure of at least the first cured resin and the electronic part, and mounting the first structure on a second bottom-covering material. A third step includes applying a second molten resin onto the first structure and placing a second top-covering material on the second molten resin. A fourth step includes curing the second molten resin, thereby forming a second structure of at least the second cured resin and the first structure. A fifth step includes cutting the second structure thereby forming a card.

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