Coating processes – Direct application of electrical – magnetic – wave – or... – Polymerization of coating utilizing direct application of...
Patent
1991-08-28
1993-10-19
Lusigan, Michael
Coating processes
Direct application of electrical, magnetic, wave, or...
Polymerization of coating utilizing direct application of...
427525, 427560, 427601, 427 79, 4271263, 427203, 427204, 427346, 427387, 427409, 4274192, 427421, 361178, B05D 512
Patent
active
052543714
ABSTRACT:
This method comprises the following steps, which are compatible with thin-film technology: forming a bottom electrode (2) on an insulating substrate (1), depositing a humidity-sensitive polymer layer (5) of uniform thickness on the bottom electrode (2) leaving contact areas (3a, 3b) uncovered, activating surface bonds of the polymer layer (5), applying a colloidal dispersion of SiO.sub.2 or Al.sub.2 O.sub.3 particles (6) of uniform grain size as a thin layer to the polymer layer (5) and subsequently drying it, depositing a cover electrode (7) on the particles (6) still evenly distributed on the polymer layer (5) after the drying of the dispersion, and removing the particles (6) together with the portions of the cover electrode (7) overlying them.
REFERENCES:
patent: 4438480 (1984-03-01), Chambaz et al.
patent: 4482882 (1984-11-01), Luder et al.
patent: 4532016 (1985-07-01), Chambaz et al.
patent: 4541904 (1985-09-01), Luder et al.
patent: 4603455 (1986-08-01), Woest et al.
patent: 4761710 (1988-08-01), Chen
Hegner Frank
Kallfass Traugott
Endress u. Hauser GmbH u. Co.
Lusigan Michael
Utech Benjamin L.
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