Fishing – trapping – and vermin destroying
Patent
1993-09-07
1995-07-25
Chaudhuri, Olik
Fishing, trapping, and vermin destroying
437195, 437205, 437215, 437 8, 257723, 257786, H01L 2144
Patent
active
054361974
ABSTRACT:
A test card (10) or a semiconductor die (150) having bonding pads (41-43, 180-182) for testing semiconductor devices, and a method for making the bonding pads (41-43, 180-182) are shown. The test card (10) or the semiconductor die (150) is partitioned into a plurality of bonding pad regions (14-17 and 170-173). Bonding pads (41-43, 180-182) are formed in the respective bonding pad regions (14-17 and 170-173). The bonding pad regions (14-17 and 170-173) and the bonding pads (41-43, 180-182) are formed by patterning a layer of conductive material (16, 167) on a major surface (12) of the test card (10) or on the semiconductor die (150).
REFERENCES:
patent: 4026008 (1977-05-01), Drees
patent: 4195195 (1980-03-01), de Miranda et al.
patent: 4586242 (1986-05-01), Harrison
patent: 4801561 (1989-01-01), Sankhagowit
patent: 4875138 (1989-10-01), Cusack
patent: 4974053 (1990-11-01), Kinoshita et al.
patent: 4990996 (1991-02-01), Kumar
patent: 5002895 (1991-03-01), LeParquier et al.
patent: 5008614 (1991-04-01), Shreeve et al.
patent: 5057452 (1991-10-01), Theunissen et al.
patent: 5066831 (1991-11-01), Spielberger et al.
patent: 5153507 (1992-10-01), Fong et al.
patent: 5157476 (1992-10-01), Yoshida
Chaudhuri Olik
Dover Rennie William
Motorola Inc.
Pham Long
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