Method of manufacturing a ball grid array package

Details Method of manufacturing a ball grid array package Method of manufacturing a ball grid array package

1996-07-31

1998-10-13

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

25832, 257700, 257737, 361719, 361761, H05K 330, H05K 336

Patent

active

058193987

ABSTRACT:
The present invention proposes a method of manufacturing a ball grid array printed circuit board (210) that comprises the following steps: fabricating a printed circuit board, PCB, that comprises a matrix of ball grid array PCBs, each ball grid array PCB of the matrix is separated from its neighbors by the width of an electroplating tie bar (230); stamping the matrix of ball grid array PCBs for separating them and for forming an aperture (320) that is substantially centralized within each of them; preparing a metal sheet (510), onto which a semiconductor device (130) is mechanically attached; mechanically attaching a singularized ball grid array PCB to the metal sheet; and molding about the semiconductor device and a portion of the ball grid array PCB a protective material (140) that is substantially planar with respect to the ball grid array PCB.

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patent: 5578796 (1996-11-01), Bhatt et al.

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