Method of manufacturing a 2-layered flexible substrate

Details Method of manufacturing a 2-layered flexible substrate Method of manufacturing a 2-layered flexible substrate

1997-11-14

2000-04-04

Powell, William

Etching a substrate: processes

Forming or treating electrical conductor article

216 34, B22C 122

Patent

active

060457139

ABSTRACT:
A method of manufacturing a 2-layered flexible substrate includes forming an underlying metal layer on an insulation film with a deposition layer formed by a dry plating method using at least one of nickel, copper-nickel alloy, chromium and chromium oxide and a copper deposition layer formed by a dry plating method on the noted deposition layer, then forming a primary electric copper plated deposition layer on the underlying metal layer, then applying a treatment using at least one alkaline solution selected from inorganic alkaline solutions and organic alkaline solutions, then forming an electroless copper plated deposition layer as an intermediate metal layer on the primary electric copper plated deposition layer and, finally, forming a secondary electric copper plated deposition layer on the intermediate metal layer, thereby finally forming a copper conductor layer of 1 to 35 .mu.m thickness on the insulation film.

REFERENCES:
patent: 5721007 (1998-02-01), Lynch et al.
patent: 5800722 (1998-09-01), Tsuyoshi et al.

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