Plastic and nonmetallic article shaping or treating: processes – Including step of generating heat by friction
Patent
1980-03-11
1985-02-19
Parrish, John A.
Plastic and nonmetallic article shaping or treating: processes
Including step of generating heat by friction
264325, C04B 3564
Patent
active
045004820
ABSTRACT:
A blank is molded from a powdery mixture of silicon, .alpha.-silicon nitride, and a sintering agent. The blank is nitrided to nitride the silicon content of the blank, and thereafter the blank is subjected to hot isostatic pressing. The silicon content of the original powdery mixture is between 5% and 60% by weight of the mixture, and the sintering agent, which may be an oxide, is present in the original powdery mixture in the range between 0.1% and 10% by weight. The nitriding is carried out in a nitrogen atmosphere at a temperature between 1100.degree. C. and 1600.degree. C. The nitriding may be carried out in two stages, first at a temperature between 1050.degree. C. and 1400.degree. C., and then at a temperature above the melting point of silicon.
REFERENCES:
patent: 3108985 (1963-10-01), Weyer
patent: 3285873 (1966-11-01), Bailey
patent: 3562371 (1971-02-01), Bush
patent: 3631139 (1971-12-01), Bauer
patent: 4125592 (1978-11-01), Ezis et al.
patent: 4164528 (1979-08-01), Yajima et al.
patent: 4177230 (1979-12-01), Mazdiyasni
Mazdiyasni, "Characterization of Organosilicon-Infiltrated Porous Reaction Sintered Si.sub.3 N.sub.4 ", J. Am. Ceram. Soc., vol. 61, No. 11-12, pp. 504-508, 1978.
Levine Alan H.
Motoren-und Turbinen-Union Munchen GmbH
Parrish John A.
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