Compositions – Electrically conductive or emissive compositions – Free metal containing
Reexamination Certificate
2011-03-15
2011-03-15
Kopec, Mark (Department: 1761)
Compositions
Electrically conductive or emissive compositions
Free metal containing
C106S001190, C136S256000, C427S096100
Reexamination Certificate
active
07906045
ABSTRACT:
The present invention is directed to a thick film conductive composition comprising: (a) electrically conductive silver powder; (b) Zn-containing additive wherein the particle size of said zinc-containing additive is in the range of 7 nanometers to less than 100 nanometers; (c) glass frit wherein said glass frit has a softening point in the range of 300 to 600° C.; dispersed in (d) organic medium. The present invention is further directed to a semiconductor device and a method of manufacturing a semiconductor device from a structural element composed of a semiconductor having a p-n junction and an insulating film formed on a main surface of the semiconductor comprising the steps of (a) applying onto said insulating film the thick film composition as describe above; and (b) firing said semiconductor, insulating film and thick film composition to form an electrode.
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Carroll Alan Frederick
Hang Kenneth Warren
Wang Yueli L.
Young Richard John Sheffield
E. I. Du Pont de Nemours and Company
Kopec Mark
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