Method of manufacture of multilayer circuit boards

Details Method of manufacture of multilayer circuit boards Method of manufacture of multilayer circuit boards

1998-03-06

2000-09-26

Talbot, Brian K.

Coating processes

With post-treatment of coating or coating material

Swelling agent or solvent applied to treat coating

427337, 427 97, 205125, 205166, 205210, B05D 304, C25D 534

Patent

active

06123995&

ABSTRACT:
A method of providing an electrically conductive polymer coating on a copper clad circuit board prior to electroplating is disclosed. The method teaches the application of certain organic solvents to a conductive polymer composition already applied to the board but before drying the conductive polymer composition to remove liquids therefrom to form a conductive polymer film.

REFERENCES:
patent: 4218498 (1980-08-01), Cohen
patent: 5415762 (1995-05-01), Allardyce et al.
patent: 5528000 (1996-06-01), Allardyce et al.
patent: 5648125 (1997-07-01), Cane
patent: 5667662 (1997-09-01), Sonnenberg et al.

Affiliated with

Also associated with

Rating

Method of manufacture of multilayer circuit boards does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacture of multilayer circuit boards, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacture of multilayer circuit boards will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2097825