Method of manufacture of multilayer circuit board

Details Method of manufacture of multilayer circuit board Method of manufacture of multilayer circuit board

1993-01-29

1994-06-07

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29852, 156902, 2281801, 427 97, H05K 336

Patent

active

053178017

ABSTRACT:
A method for the manufacture of a multilayer printed circuit board on which integrated circuit chips may be directly mounted includes producing holes at predetermined locations to enable electrical connections between a chip and conductive layers of the circuit board to be established via the holes. Electrically conductive bump members, which protrude outwardly from the circuit board, are formed in registration with the holes. The bump members cooperate with an electrically conductive plating layer or filler that is deposited so as to be in intimate contact with a conductive layer(s) exposed during the production of each hole.

REFERENCES:
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patent: 4566186 (1986-01-01), Baver et al.
patent: 4642160 (1987-02-01), Burgess
patent: 4818728 (1989-04-01), Rai et al.
patent: 4935584 (1990-06-01), Boggs
patent: 5152868 (1992-10-01), Schiltz et al.
IBM Tech. Disclosure Bulletin vol. 21 No. 4, Sept. 1978 pp. 1396-1397 by D. R. Tomsa et al.

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