Method of manufacture of heat exchange unit

Metal working – Method of mechanical manufacture – Heat exchanger or boiler making

Reexamination Certificate

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Details

C029S890030, C029S557000

Reexamination Certificate

active

06195893

ABSTRACT:

BACKGROUND OF THE INVENTION
The field of the present invention is heat exchange components.
A number of heat exchanging components have been developed for the dissipation of heat from electronic components. Reference is made to Japanese Patent Publications 1989-27736; 1989-264296; 1989-266922 and 1992-313687, the disclosures of which are incorporated herein by reference. These disclosures describe heat dissipation items with multiple numbers of pin-shaped protrusions formed generally through plastic deformation from a base plate unit. The disclosed devices have significant heat dissipation properties. However, when used with electronic components additional heat dissipation is needed as the integrated density of the electronic components increases. This can be true even if cooling air is forced through the inside of the component case. Even though the components may become better able to transfer heat, the overall system may not become more efficient.
Heat pipes have been known for creating more efficient transfer. Attempts have been made to integrate such heat pipe structures with heat exchange components. However, the formation of long holes to receive the heat pipes has been problematic. Conical point drilling is difficult, provides low productivity and creates a cavity not conducive for heat transfer to inserted heat pipes. Conical point cutting marks from the drills leave helical lines in the peripheral wall which can negatively impact heat transfer. Further, the fit of the heat pipe element within such a hole typically leaves significant areas without direct contact. Again, heat transfer efficiency is reduced. Finally, drills are only able to create cylindrical holes of circular cross section.
SUMMARY OF THE INVENTION
The present invention is directed to the provision of heat exchange units having long holes able to accommodate heat pipes in the base plates of such units. Smooth peripheral surfaces of the holes and an appropriate fit with an inserted heat pipe are contemplated as the result of the method of forming that structure.
In a first separate aspect of the present invention, base plates and heat dissipating protrusions of a heat exchange unit are formed through plastic deformation of a metal billet. Mandrels are placed in long holes within the billet prior to plastic deformation and are removed after such deformation. Holes of relatively small diameter to length are able to be formed with varying cross-sectional shapes and orientations. A mirror surface can be obtained based on the surface precision of the mandrels.
In a second separate aspect of the present invention, the method of the first aspect is enhanced through the thermal expansion of the base plate prior to extraction of the mandrels.
In a third separate aspect of the present invention, the insertion of heat pipes into the long holes created by the method contemplated in the first separate aspect is enhanced through the deformation of the base plate to compress each long hole against each heat pipe for improved heat conduction.
Accordingly, it is an object of the present invention to provide a new method of manufacture of a new heat exchange component where precise long holes are formed through the base plate simultaneously with the forming process of the component through plastic deformation. Other and further objects and advantages will appear hereinafter.


REFERENCES:
patent: 5419041 (1995-05-01), Ozeki
patent: 5428897 (1995-07-01), Jordan et al.
patent: 5572789 (1996-11-01), Fisher et al.
patent: 5638715 (1997-06-01), Lipinski
patent: 5711069 (1998-01-01), Hundt
patent: 5758418 (1998-06-01), Chrysler et al.
patent: 1989-27736 (1989-01-01), None
patent: 1989-264296 (1989-10-01), None
patent: 1989-266922 (1989-10-01), None
patent: 1992-313687 (1992-11-01), None

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