Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2006-05-23
2006-05-23
Trinh, Minh (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S832000, C029S841000, C174S252000
Reexamination Certificate
active
07047637
ABSTRACT:
Method of manufacture of a composite wiring structure for use with at least one semiconductor device, the structure having a first conductive member upon which the semiconductor device can be mounted for electrical connection thereto. A dielectric member, made of ceramic or organo-ceramic composite material, is bonded to the first conductive member and contains embedded therein a conductive network and a thermal distribution network. A second conductive member may be incorporated with the composite wiring structure, with a capacitor electrically connected between the conductive network and the second conductive member. Bonding between the dielectric member and the conductive members may be in the form of a direct covalent bond formed at a temperature insufficient to adversely effect the structural integrity of the conductive network and the thermal distribution network.
REFERENCES:
patent: 3676292 (1972-07-01), Pryor et al.
patent: 3869312 (1975-03-01), Moss et al.
patent: 4071385 (1978-01-01), Kuris
patent: 4267210 (1981-05-01), Yajima et al.
patent: 4372037 (1983-02-01), Scapple et al.
patent: 4410874 (1983-10-01), Scapple et al.
patent: 4551357 (1985-11-01), Takeuchi
patent: 4598167 (1986-07-01), Ushifusa et al.
patent: 4679321 (1987-07-01), Plonski
patent: 4770953 (1988-09-01), Horiguchi et al.
patent: 4880770 (1989-11-01), Mir et al.
patent: 4942079 (1990-07-01), Kumagai et al.
patent: 4950643 (1990-08-01), Agostinelli et al.
patent: 4959507 (1990-09-01), Tanaka et al.
patent: 4981761 (1991-01-01), Ookouchi et al.
patent: 4987677 (1991-01-01), Tanaka et al.
patent: 5010053 (1991-04-01), Maroni
patent: 5011732 (1991-04-01), Takeuchi et al.
patent: 5024883 (1991-06-01), SinghDeo et al.
patent: 5071828 (1991-12-01), Greuter et al.
patent: 5077270 (1991-12-01), Takeda et al.
patent: 5083368 (1992-01-01), Frank
patent: 5096878 (1992-03-01), Hoshino et al.
patent: 5104849 (1992-04-01), Shiga et al.
patent: 5108026 (1992-04-01), Su et al.
patent: 5113315 (1992-05-01), Capp et al.
patent: 5116808 (1992-05-01), Belouet
patent: 5153077 (1992-10-01), Kashiba et al.
patent: 5155665 (1992-10-01), Komorita et al.
patent: 5168420 (1992-12-01), Ramesh et al.
patent: 5187149 (1993-02-01), Jin et al.
patent: 5227338 (1993-07-01), Kryzaniwsky
patent: 5251803 (1993-10-01), Kashiba et al.
patent: 5256443 (1993-10-01), Tomita
patent: 5256469 (1993-10-01), Cherukuri et al.
patent: 5300163 (1994-04-01), Ohtaki
patent: 5318800 (1994-06-01), Gong et al.
patent: 5325265 (1994-06-01), Turlik et al.
patent: 5336532 (1994-08-01), Haluska et al.
patent: 5338598 (1994-08-01), Ketcham
patent: 5342653 (1994-08-01), Simon et al.
patent: 5348805 (1994-09-01), Zagdoun et al.
patent: 5363277 (1994-11-01), Tanaka
patent: 5363280 (1994-11-01), Chobot et al.
patent: 5375039 (1994-12-01), Wiesa
patent: 5396034 (1995-03-01), Fujita et al.
patent: 5430008 (1995-07-01), Morris
patent: 5442240 (1995-08-01), Mukerji
patent: 5444298 (1995-08-01), Schutz
patent: 5470668 (1995-11-01), Wu et al.
patent: 5473511 (1995-12-01), Reddy et al.
patent: 5475264 (1995-12-01), Sudo et al.
patent: 5506755 (1996-04-01), Miyagi et al.
patent: 5540981 (1996-07-01), Gallagher et al.
patent: 5548481 (1996-08-01), Salisbury et al.
patent: 5562973 (1996-10-01), Nagasaka et al.
patent: 5576934 (1996-11-01), Roethlingschoefer et al.
patent: 5600541 (1997-02-01), Bone et al.
patent: 5602421 (1997-02-01), Li
patent: 5604018 (1997-02-01), Horiuchi et al.
patent: 5621190 (1997-04-01), Yamasaki et al.
patent: 5644327 (1997-07-01), Onyskevych et al.
patent: 5669136 (1997-09-01), Magee
patent: 5691498 (1997-11-01), Fogle, Jr.
patent: 5700549 (1997-12-01), Garant et al.
patent: 5707715 (1998-01-01), deRochemont et al.
patent: 5714801 (1998-02-01), Yano et al.
patent: 5725938 (1998-03-01), Jin et al.
patent: 5731066 (1998-03-01), Ando et al.
patent: 5731067 (1998-03-01), Asai et al.
patent: 5752182 (1998-05-01), Nakatsuka et al.
patent: 5768109 (1998-06-01), Gulick et al.
patent: 5773197 (1998-06-01), Carter et al.
patent: 5818079 (1998-10-01), Noma et al.
patent: 5821162 (1998-10-01), Yamaha et al.
patent: 5838545 (1998-11-01), Clocher et al.
patent: 5849100 (1998-12-01), Bowden
patent: 5866252 (1999-02-01), deRochemont et al.
patent: 5870823 (1999-02-01), Bezama et al.
patent: 5883219 (1999-03-01), Carter et al.
patent: 5904576 (1999-05-01), Yamaha et al.
patent: 5919546 (1999-07-01), Horiuchi et al.
patent: 5962113 (1999-10-01), Brown et al.
patent: 5997999 (1999-12-01), Horiuchi et al.
patent: 030115 (1980-11-01), None
patent: 06-255019 (1994-09-01), None
patent: WO 89/08324 (1989-09-01), None
patent: WO 98/08672 (1998-03-01), None
P. Arendt, et al. “Fabrication of Biaxially Oriented YBCO ON (001) Biaxially Oriented Yttria-Stabilized-Zirconia On Polycrystlline Substrates,” MRS Symposium Proceedings on Epitaxial Oxide Thin Films and Heterostructures, MRS Bulletin 341 (1994)**.
S. R. Foltyn, et al. “Pulsed Laser Deposition of Thick YBa2Cu3O7-d Films On Flexible Substrates.” Proceedings of the International Workshop on Superconductivity, Jun. 18-21, 1995, Maui, Hawaii.**.
X.D. Wu, et al. “High Current YBa2Cu3O7-d Thick Films On Flexible Nickel Substrates With Textured Buffer Layers,” Applied Physics Letters 65 (15), Oct. 10, 1994.**.
S. R. Foltyn, et al. “Pulsed Laser Deposition of Thick YBa2Cu3O7-d Films with Jc>1 MA/cm2.” Applied Physics Letters, 63 (13), Sep. 27, 1993.**.
Hiroyuki Nasu, et al. “Superconducting Y-Ba-Cu-O Films with Tc>70 K Prepared by Thermal Decomposition Technique of Y-, and cu-2ethylhexanoates,” Chemistry Letters pp. 2403-2404 (1987).**.
Hiroyuki Nasu, et al. “Ba24CU3Or films with Tc(end)>80K prepared by the pyrolysis of 2-ethylhexanoates,”Journal of Materials Science Letters 7 88 858-260 (1986).**.
W.J. DeSisto, et al. “YBa2Cu3O7-d thin films deposited by an ultrasonic nebulization and pyrolysis method,” Thin Solid Films, 206, pp. 128-131 (1991).**.
Pierre deRochemont, et al. “Fabricating Multifilamentary High-TcSuperconducting Bismuth Cuprate Tapes By Metalorganic Chemical Spray Pryolysis,”Applied Superconductivity, vol. 2, No. 3/4, pp. 281-294, 1994.**.
P. Arendt, et al. “Highly-Textured Ti-Ba-Ca-Cu-O Polycrystalline Superconducting Films on Ag Substrates,”Science and Technology of Thin Film Superconductors 2, ed. By McConnell and Noufi, Plenum Press, New York, 1990.**.
deRochemont L. Pierre
Farmer Peter H.
Burns & Levison LLP
Erlich Jacob N.
Hamilton John A.
Nguyen Donghai D.
LandOfFree
Method of manufacture of ceramic composite wiring structures... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of manufacture of ceramic composite wiring structures..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacture of ceramic composite wiring structures... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3596418