Metal fusion bonding – Process – Alternative bonding
Patent
1993-04-09
1994-04-05
Heinrich, Samuel M.
Metal fusion bonding
Process
Alternative bonding
29868, H01L 2160
Patent
active
052997278
ABSTRACT:
The invention relates to a method for manufacture of an optoelectronic coupling element having a multi-part housing, in which a first housing section is designed as a plug and a second housing section as the receptacle receiving said plug, and where at least one optoelectronic element each is mounted on a contact strip in said first and second housing sections. The method in accordance with the invention is characterized in that the first and second housing sections are initially shaped around one contact strip segment each, in that in a further process step the optoelectronic elements are mounted in cutouts in the interiors of the plug and the receptacle, and in that the plug and the receptacle are joined together after manufacture of the electrical connections of the optoelectronic elements with their respective contact strips.
REFERENCES:
patent: 3878397 (1975-04-01), Robb et al.
patent: 4863232 (1989-09-01), Kwa
patent: 4890894 (1990-01-01), Kwa
Patent Abstracts of Japan; vol. 6, No. 67 (E-104)(945), Apr. 28th, 1982 & JP-A-57 007 170 (Nitsushin), Jan. 14th, 1982.
Motorola Inc., Technical Developments, vol. 14, Dec. 1991, V. J. Adams "Pre Assembled Opto . . . ".
Heinrich Samuel M.
TEMIC Telefunken microelectronic GmbH
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