Metal working – Method of mechanical manufacture – Electrical device making
Patent
1995-05-17
1997-12-30
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
324 731, 324760, H01K 310
Patent
active
057016674
ABSTRACT:
This disclosure describes an Interconnect Stress Testing (IST) system and a printed wiring board test coupon which is used with the IST system. The system includes a computer device and a cabinet which is used for mounting the test coupon as well as housing a number of the other components that make up the system. During a pre-cycling phase, the system determines the correct current that should be passed through the coupon in order to heat it to a predetermined temperature. After that test current value is determined the system actually stress tests the coupon by passing the determined test current through the coupon. It does so for a selected number of cycles, and monitors resistance changes in the coupon during testing while recording test data. This disclosure also describes the test coupon, which is designed to uniformly dissipate the heat created during stress cycling.
REFERENCES:
patent: 4510446 (1985-04-01), Braun et al.
patent: 4894606 (1990-01-01), Paur
patent: 4985675 (1991-01-01), Turodie
patent: 5172063 (1992-12-01), Munikoti et al.
patent: 5392219 (1995-02-01), Birch et al.
patent: 5451885 (1995-09-01), Birch et al.
Insulation/Circuits vol. 25, No. 8 pp. 20-23, Jul. 1979 by I. Farkass (Abstract only).
"A New Power Cycling Technique for Accelerated Reliability Evaluation of Plated Through Holes and Interconnects in PCB's", Ramachandra Munikoti and Pulak Dhar. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 13, No. 4, Dec. 1990.
"A New Power Cycling Technique for Accelerated Reliability Evaluation of Plated-Through-Holes and Interconnects in PCBs", Ramachandra Munikoti and Pulak Dhar.
"Detecting Subtle Flaws With Temperature Cycle Testing", Robert M. Murchko and James J. Tomine, IBM Corp.
"Power Cycling"Michael R. Strange, Quality, Sep., 1980, pp. 29-31.
Birch Stephen Michael
Gavrel Gerard Michel
Memon Zaffar Iqbal
Arbes Carl J.
Digital Equipment Corporation
Hudgens Ronald C.
Steubing Mary M.
LandOfFree
Method of manufacture of an interconnect stress test coupon does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of manufacture of an interconnect stress test coupon, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacture of an interconnect stress test coupon will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-193270