Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2005-03-29
2005-03-29
Smith, Matthew (Department: 2825)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Packaging or treatment of packaged semiconductor
C438S022000, C438S030000, C438S032000, C438S048000, C347S002000, C349S001000, C349S042000, C349S043000, C349S106000, C257S013000
Reexamination Certificate
active
06872586
ABSTRACT:
A manufacturing method of an active matrix substrate which can prevent the complexity of manufacturing processes, widens the range of material choice and allows high manufacturing yield, and a manufacturing method of a liquid crystal display using such active matrix substrate. Conductive colored layers (606to608) functioning as pixel electrodes and color filters are formed by a process of discharging, by an ink jet method, a mixed ink of coloring material and conductive material to the formation area of a pixel electrode to be connected electrically to an active element (602).
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Aruga Hisashi
Katagami Satoru
Kawase Tomomi
Kiguchi Hiroshi
Shimizu Masaharu
Lee Jr. Granvill D
Oliff & Berridg,e PLC
Seiko Epson Corporation
Smith Matthew
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