Semiconductor device manufacturing: process – Manufacture of electrical device controlled printhead
Reexamination Certificate
1998-07-10
2001-02-20
Bowers, Charles (Department: 2813)
Semiconductor device manufacturing: process
Manufacture of electrical device controlled printhead
C347S023000, C347S040000, C347S047000, C347S048000, C347S054000, C347S082000
Reexamination Certificate
active
06190931
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates to the manufacture of ink jet print heads and, in particular, discloses a method of manufacture of a Linear- Spring, Electromagnetic-Grill Ink Jet Printer.
BACKGROUND OF THE INVENTION
Many ink jet printing mechanisms are known. Unfortunately, in mass production techniques, the production of ink jet heads is quite difficult. For example, often, the orifice or nozzle plate is constructed separately from the ink supply and ink ejection mechanism and bonded to the mechanism at a later stage (Hewlett-Packard Journal, Vol. 36 no 5, pp33-37 (1985)). These separate material processing steps required in handling such precision devices often add a substantial expense in manufacturing.
Additionally, side shooting ink jet technologies (U.S. Patent No. 4,899,181) are often used but again, this limits the amount of mass production throughput given any particular capital investment.
Additionally, more esoteric techniques are also often utilised. These can include electroforming of nickel stage (Hewlett-Packard Journal, Vol. 36 no 5, pp33-37 (1985)), electro-discharge machining, laser ablation (U.S. Patent No. 5,208,604), micro-punching, etc.
The utilisation of the above techniques is likely to add substantial expense to the mass production of ink jet print heads and therefore add substantially to their final cost.
It would therefore be desirable if an efficient system for the mass production of ink jet print heads could be developed.
SUMMARY OF THE INVENTION
It is an object of present invention to provide an alternative form of ink jet printing.
In accordance with a first aspect of the present invention, there is provided a method of manufacturing a linear spring electromagnetic grill ink jet print head wherein an array of nozzles are formed on a substrate utilising planar monolithic deposition, lithographic and etching processes. Preferably, multiple ink jet heads are formed simultaneously on a single planar substrate such as a silicon wafer.
The print heads can be formed utilising standard vlsi/ulsi processing and can include integrated drive electronics formed on the same substrate. The drive electronics preferably are of a CMOS type. In the final construction, ink can be ejected from the substrate substantially normal to the substrate.
In accordance with a further aspect of the present invention, there is provided a method of manufacture of an ink jet print head arrangement including a series of nozzle chambers, the method comprising the steps of: (a) utilizing an initial semiconductor wafer having an electrical circuitry layer and a buried epitaxial layer formed thereon; (b) etching a nozzle chamber aperture in the electrical circuitry layer interconnected with a nozzle chamber in the semiconductor wafer; (c) depositing a first sacrificial layer filling the nozzle chamber; (d) depositing and etching an inert material layer including a grill structure over the nozzle chamber aperture and vias for electrical interconnection of subsequent layers with the electrical circuitry layer; (e) depositing and etching a first conductive material layer including a series of lower electrical coil portions interconnected with the electrical circuitry layer; (f) depositing and etching an inert material layer over the first conductive material layer, the inert material layer including predetermined vias for interconnection of the first conductive material layer with subsequent layers; (g) depositing and etching a second sacrificial layer including etching a mould for a solenoid, a fixed magnetic pole, and a linear spring anchor; (h) depositing and etching a high saturation flux material layer to form the series of fixed magnetic poles, a linear spring, the linear spring anchor and an interconnected shutter grill; (i) depositing and etching a second inert material layer over the high saturation flux material layer including predetermined vias for interconnection of lower layers with subsequent layers; 0) depositing and etching a second conductive material layer including side electrical coil portions surrounding the series of fixed magnetic poles interconnected with the first conductive material layer; (k) depositing and etching a third conductive material layer including a top electrical coil portion interconnected with the side conductive material layer; (1) depositing and etching a top inert material layer as a corrosion barrier; (m) back etching the wafer to the epitaxial layer; (n) etching a nozzle aperture in the epitaxial layer; and (o) etching away the sacrificial layers.
The epitaxial layer can be utilized as an etch stop in the step (b) which can comprise a crystallographic etch of the wafer.
The high saturation flux material can comprise substantially a cobalt nickel iron alloy and the conductive layers can comprise substantially copper with the inert layers comprising substantially silicon nitride.
The steps are preferably also utilized to simultaneously separate the wafer into separate printheads.
REFERENCES:
patent: 4458255 (1984-07-01), Giles
patent: 5070317 (1991-12-01), Bhagat
patent: 5644177 (1997-07-01), Guckel et al.
patent: 5710466 (1998-01-01), Allen et al.
patent: 5719605 (1998-02-01), Andersen et al.
patent: 5788468 (1998-08-01), Dewa et al.
patent: 5808384 (1998-09-01), Tabat et al.
patent: 5971355 (1999-10-01), Biegelsen et al.
Bowers Charles
Kielin Erik
Silverbrook Research Pty. Ltd.
LandOfFree
Method of manufacture of a linear spring electromagnetic... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of manufacture of a linear spring electromagnetic..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacture of a linear spring electromagnetic... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2591095