Etching a substrate: processes – Forming or treating thermal ink jet article
Reexamination Certificate
2005-03-15
2005-03-15
Gulakowski, Randy (Department: 1746)
Etching a substrate: processes
Forming or treating thermal ink jet article
C347S044000, C347S054000
Reexamination Certificate
active
06866789
ABSTRACT:
This patent describes a method of manufacturing a gear driven shutter ink jet print head wherein an array of nozzles are formed on a substrate utilising planar monolithic deposition, lithographic and etching processes. Multiple ink jet heads are formed simultaneously on a single planar substrate such as a silicon wafer. The print heads can be formed utilising standard VLSI/ULSI processing and can include integrated drive electronics formed on the same substrate. The drive electronics preferably being of a CMOS type. In the final construction, ink can be ejected from the substrate substantially normal to the substrate plane.
REFERENCES:
patent: 4199767 (1980-04-01), Campbell et al.
patent: 5072241 (1991-12-01), Shibaike et al.
patent: 5500685 (1996-03-01), Hattori et al.
Ahmed Shamim
Gulakowski Randy
Silverbrook Research PTY LTD
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