Method of manufacture multilayer circuit package

Details Method of manufacture multilayer circuit package Method of manufacture multilayer circuit package

1997-03-03

1999-02-09

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29846, 29852, 174260, 174263, 361768, H05K 334

Patent

active

058678980

ABSTRACT:
A metal carrier has a dielectric material with a thickness of less than 0.004 inch and electrical voltage insulation characteristics of at least 2500 volts formed on a surface. A donut configured land defines at least one via or opening for removing dielectric material selectively. Reflow solder is used to form electrical interconnections, and the vias provide thermal dissipation sufficient to conform to safety requirements.

REFERENCES:
patent: 4528064 (1985-07-01), Ohsawa et al.
patent: 4893404 (1990-01-01), Shirahata et al.
patent: 5200026 (1993-04-01), Okabe
patent: 5227013 (1993-07-01), Kumar
patent: 5258094 (1993-11-01), Furvi et al.
patent: 5263243 (1993-11-01), Taneda et al.
patent: 5729893 (1998-03-01), Tanifuji et al.

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