Method of manufacting an SMD resistor

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating selected area

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29620, 216 16, 427103, H01C 1706

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056835663

ABSTRACT:
A resistor of SMD (Surface Mounted Device) construction includes a film of a resistive alloy as a resistive track on two electrically separated carrier plate elements of copper, which are constructed as contact elements solderable to the terminals of a printed circuit board to thereby ensure good heat dissipation into a printed circuit board. In order to manufacture such resistors, a resistive film sufficient for a plurality of individual resistors is adhered to but electrically isolated from a large copper plate and the laminate formed thereby is split into the individual resistors after producing the individual resistive tracks and their electrical connections to the copper plate and after producing gaps between the plate elements for each track.

REFERENCES:
patent: 2101441 (1937-12-01), Marsten
patent: 2291246 (1942-07-01), Marsten
patent: 3761860 (1973-09-01), Ogasawara et al.
patent: 3775725 (1973-11-01), Endo
patent: 4301439 (1981-11-01), Johnson et al.
patent: 4628167 (1986-12-01), Sakiguchi et al.
patent: 5111179 (1992-05-01), Flassayer et al.
patent: 5179366 (1993-01-01), Wagner
patent: 5181313 (1993-01-01), Nonnemacher et al.
patent: 5379017 (1995-01-01), Katsuno
patent: 5450055 (1995-09-01), Doi
Elektronik Produktion & Pruftechnik, May 1987, p. 68.

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