Method of making wires scribed circuit boards

Metal working – Method of mechanical manufacture – Electrical device making

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Details

174 685, H01K 310

Patent

active

047110260

ABSTRACT:
This invention relates to interconnection circuit boards and processes for making and modifying interconnection circuit boards wherein adhesive is applied to a wire used in scribing a conductor pattern. The adhesive is activated to a tacky state during the wire scribing operation which forms the conductor pattern, and can thereafter be cured to permanently bond the conductors to the board surface.

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patent: 4414741 (1983-11-01), Holt
patent: 4450623 (1984-05-01), Burr
Miller, Carl, "Soldering With Light", Photonics Spectra, May 1983, pp. 83-85.
Loefler, Jr. J. R., N/C "Laser Soldering Fast, Low cost, No Rejects, Assembly Engineering, Mar. 7, 1977, pp. 32-34.
Augat, Inc., "Augat Planar Stitch Wiring", 1983 Additive Technology Corp., The Wire Ink Company, 1983.
Floury, et al., "An Automatic Wiring Equipment for Hybrid Substrates", Proc. 32nd Electronic Comp. Conf., May 1982.
Webizky, et al., "Making 200,000 Circuits Fit Where At Most 6,000 Fit Before", Electronics, vol. 52, No. 15, Aug. 2, 1979.

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