Method of making wireless semiconductor device, and...

Details Method of making wireless semiconductor device, and... Method of making wireless semiconductor device, and...

2005-05-24

2005-05-24

Lee, Eddie (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Solder wettable contact, lead, or bond

C257S772000, C257S666000, C257S672000, C257S673000, C257S782000

Reexamination Certificate

active

06897567

ABSTRACT:
A method of making a semiconductor device is provided. The method includes the following steps. First, a semiconductor chip is mounted on a lower conductor, with first solder material applied between the chip and the lower conductor. Then, an upper conductor is placed on the chip, with second solder material applied between the chip and the upper conductor. Then, the first and the second solder materials are heated up beyond their respective melting points. Finally, the first and the second solder materials are allowed to cool down, so that the first solder material solidifies earlier than the second solder material.

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