Metal fusion bonding – Process – Plural joints
Patent
1999-01-07
2000-10-17
Ryan, Patrick
Metal fusion bonding
Process
Plural joints
228 11, 228 45, 2281791, B23K 106, B23K 3700, B23K 3100
Patent
active
061317993
ABSTRACT:
In a method of making a wire connection of predetermined shape between a first connecting point located on a semiconductor chip and a second connecting point a capillary is moved along a predetermined trajectory. After attaching the wire at the first connecting point the capillary is moved up to a first point for the performing of one or two kinks and for the pulling out of the wire as far as the required total length of the wire connection. From the first point, the capillary is moved along a circular arc up to a second point, at which the wire is locked in the capillary. The circular arc is centered in the first connecting point or in the immediate vicinity of the first connecting point. The method is suitable for the wiring of CSPs (Chip Scale Packages). The movement along the circular arc prevents the wire from being pushed back through the capillary. As soon as the wire is locked in the capillary, the second connecting point can be approached without difficulty.
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Egger Hans
Seidel Marit
ESEC SA
Newsome Cecilia
Ryan Patrick
LandOfFree
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