Method of making wafer having adhesive skin barrier layer

Details Method of making wafer having adhesive skin barrier layer Method of making wafer having adhesive skin barrier layer

1996-07-03

1998-02-10

Crispino, Richard

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156267, 156295, 156324, B29C 3912, B29C 4112

Patent

active

057164754

ABSTRACT:
An adhesive wafer is disclosed having a thin barrier layer of soft, pliant adhesive material with particles of one or more hydrocolloids dispersed therein. A flexible and preferably stretchable cover layer extends along one side of the barrier layer and a removable release sheet protects the opposite side of the barrier layer. The wafer has a central zone and a relatively large outer zone surrounding that central zone, with the material of the barrier layer in the outer zone having generally uniform molecular orientations in radial directions over an arc of 360 degrees and being of relatively uniform tensile strength in all such radial directions. Also disclosed are injection/compression molding methods for making such wafers.

REFERENCES:
patent: 1084708 (1914-01-01), Ohliger
patent: 2098395 (1937-11-01), Law
patent: 4738257 (1988-04-01), Meyer et al.
patent: 4867748 (1989-09-01), Samuelsen
patent: 5074944 (1991-12-01), Trenka
patent: 5133821 (1992-07-01), Jensen
patent: 5332613 (1994-07-01), Taylor et al.

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