Method of making vented seal for electronic components and an en

Details Method of making vented seal for electronic components and an en Method of making vented seal for electronic components and an en

1987-10-26

1989-11-21

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

295921, 73706, 73727, 1563031, H05K 330, G01L 700

Patent

active

048813206

ABSTRACT:
An improved seal for electronic components is disclosed, having a hydrophobic, microporous membrane sealed about a housing aperture to provide substantial internal to external pressure equalization during temperature and pressure variations encountered during the solder and cleaning process, while substantially sealing the housing aperture from damaging amounts of external contaminating fluids.
The microporous membrane may be secured to a non-porous tape about a tape aperture, and the tape may be secured to the electronic component housing about the housing aperture; or the microporous membrane may be secured directly to the housing about the housing aperture.
The hydrophobic, microporous membrane may be permanently sealed to the electronic component housing about the housing aperture; or the microporous membrane may be removed after the solder and cleaning process is completed. A tab portion may be secured to the microporous membrane for ease of removal.

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patent: 4568807 (1986-02-01), Piber
patent: 4663227 (1987-05-01), Yamamori et al.
patent: 4686764 (1987-08-01), Adams et al.
patent: 4732042 (1988-03-01), Adams

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