Method of making ultrahigh density charge transfer device

Details Method of making ultrahigh density charge transfer device Method of making ultrahigh density charge transfer device

1993-05-11

1995-06-06

Batten, Jr., J. Reed

Metal founding

Process

Shaping liquid metal against a forming surface

164113, B22D 1900

Patent

active

054213967

ABSTRACT:
Metal heated to a molten state is injected under a high hydrostatic penetion pressure into extremely small and closely spaced channels of an insulating matrix to form an array of electrically conductive pins or wires. The materials for the pins and matrix are selected for compatibility with respect to melting, matrix sintering and surface tension penetration conditions associated with the fabrication of a high density charge transfer device.

REFERENCES:
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patent: 3853635 (1974-12-01), Demendi
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patent: 4044816 (1977-08-01), Krueger et al.
patent: 4726413 (1988-02-01), Hellebrand et al.
patent: 4932099 (1990-06-01), Corwin
patent: 5194202 (1993-03-01), Yun et al.

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