Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2008-07-25
2010-10-19
Banks, Derris H (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S830000, C029S831000, C029S832000, C029S712000
Reexamination Certificate
active
07814652
ABSTRACT:
A sensor assembly for sensors such as microfabricated resonant sensors is disclosed. The disclosed assembly provides improved performance of the sensors by providing a thermally insensitive environment and short pathways for signals to travel to processing components. Further, the assembly provide modular construction for the sensors and housing modules, thereby allowing replacement of the sensors at a lower cost. The assembly includes a sensor module including a sensor formed on a conductive substrate with a cavity formed on one surface. The substrate has conductive vias extending from the cavity to a second surface of the substrate. A housing assembly accommodates the sensor and includes a rigid housing, preferably made from a ceramic. An electronic component, such as an amplifier, is mounted on the rigid housing. The electronic component electrically engages the vias substantially at the second surface of the substrate. The electronic component receive signals from the sensor through the vias. The signals are then processed through an amplifier and a digital signal processor using a modified periodogram.
REFERENCES:
patent: 4426768 (1984-01-01), Black et al.
patent: 4874484 (1989-10-01), Foell et al.
patent: 5157403 (1992-10-01), Urkowitz
patent: 5262021 (1993-11-01), Lehmann et al.
patent: 5424245 (1995-06-01), Gurtler et al.
patent: 5445971 (1995-08-01), Rohr
patent: 5490034 (1996-02-01), Zavracky et al.
patent: 5511428 (1996-04-01), Goldberg et al.
patent: 5585068 (1996-12-01), Panetz et al.
patent: 5653939 (1997-08-01), Hollis et al.
patent: 5681448 (1997-10-01), Uchiyama et al.
patent: 5747116 (1998-05-01), Sharan et al.
patent: 5804741 (1998-09-01), Freeman
patent: 5870351 (1999-02-01), Ladabaum et al.
patent: 5894452 (1999-04-01), Ladabaum et al.
patent: 5982709 (1999-11-01), Ladabaum et al.
patent: 5983734 (1999-11-01), Mathur et al.
patent: 6033852 (2000-03-01), Andle et al.
patent: 6198168 (2001-03-01), Geusic et al.
patent: 6221769 (2001-04-01), Dhong et al.
patent: 6222276 (2001-04-01), Bertin et al.
patent: 6252300 (2001-06-01), Hsuan et al.
patent: 6268660 (2001-07-01), Dhong et al.
patent: 6285063 (2001-09-01), Splett et al.
patent: 6291332 (2001-09-01), Yu et al.
patent: 6297157 (2001-10-01), Lopatin et al.
patent: 6391658 (2002-05-01), Gates et al.
patent: 6430109 (2002-08-01), Khuri-Yakub et al.
patent: 6688158 (2004-02-01), Cunningham et al.
patent: 6790775 (2004-09-01), Fartash
patent: 2002/0028519 (2002-03-01), Yguerabide et al.
patent: 2002/0070841 (2002-06-01), Doppalapudi et al.
patent: 2002/0115198 (2002-08-01), Nerenberg et al.
patent: 2003/0010745 (2003-01-01), Field
patent: 2003/0119220 (2003-06-01), Mlcak et al.
patent: 2004/0043615 (2004-03-01), Yamamoto et al.
patent: 02/25630 (2002-03-01), None
Al-Sarawi, S. F., et al., “A Review of 3-D Packaging Technology.” IEEE Transactions on Components, Packaging, and Manufacturing Technology—Part B, vol. 21, No. 1, pp. 2-14, (1998).
Anthony, T. R., “Forming electrical interconnections through semiconductor wafers.” Journal of Applied Physics, vol. 52, No. 8, pp. 5340-5349 (1981).
Baer, R.L., et al., “Phase Noise Measurements of Flexural Plate Wave Ultrasonic Sensors”, 1991 IEEE Ultrasonics Symposium, pp. 321-326, (1991).
Bean, Kenneth E., “Anisotropic Etching of Silicon.” IEEE Transactions on Electron Devices, vol. 25, No. 10 pp. 1185-1193, (1978).
Belov, Larissa., et al., “Immunophenotyping of Leukemias Using a Cluster of Differentiation Antibody Microarray.” Cancer Research, vol. 61, pp. 4483-4489, (2001).
Britton, C. L. et al., “Multiple-input microcantilever sensors.” Ultramicroscopy, vol. 82, pp. 17-21, (2000).
Carstensen, J., et al., “Pore formation mechanisms for the Si-HF system.” Materials Science and Engineering, B69-70, pp. 23-28, (2000).
Chow, E. M., et al., “Integration of through-wafer interconnects with a two-dimensional cantilever array.” Sensors and Actuators, vol. 83, pp. 118-123, (2000).
Costello, B.J., et al., “A Flexural-Plate-Wave Microbial Sensor”, IEEE, 0-7803-0456-X/92, pp. 69-72.
Cunningham, B. et al., “Design, fabrication and vapor characterization of a microfabricated flexural plate resonator sensor and application to integrated sensor arrays,” Sensors and Actuators B, vol. 73, pp. 112-123 (2001).
Das, P. “A Pressure Sensing Acoustic Surface Wave Resonator”, Ultrasonics Symposium Proceedings, IEEE, pp. 306-308, (1976).
Dougherty, G. M. , et al.; “Processing and Morphology of Permeable Polycrystalline Silicon Thin Films.” Department of Materials Science and Engineering and Department of Mechanical Engineering, University of California—Berkeley—J. Mater. Res., vol. 17, No. 9, pp. 2235-2242, (2002).
Gianchandani, et al., “A Bulk Silicon Dissolved Wafer Process for Microelectromechanical Devices”, Journal of Microelectromechanical Systems, vol. 1, No. 2, pp. 77-85, (1992).
Giesler, T. et al., “Electrostatically excited and capacitively detected flexural plate waves on thin silicon nitride membranes with chemical sensor applications,” Sensors and Actuators B, vol. 18-19, pp. 103-106, (1994).
Grate, J.W., et al., “Acoustic Wave Microsensors—Part I” Analytical Chemistry, vol. 65, No. 21, pp. 940A-948A, (1993).
Grate, J.W., et al., “Acoustic Wave Microsensors—Part II” Analytical Chemistry, vol. 65, No. 22, pp. 987A-996A, (1993).
Grate, J.W., et al., “Flexural Plate Wave Devices for Chemical Analysis”, Analytical Chemistry, vol. 63, pp. 1552-1561, (1991).
Grate, J.W., et al., “Smart Sensor System for Trace Organophosphorus and Organosulfur Vapor Detection Employing a Temperature-Controlled Array of Surface Acoustic Wave Sensors, Automated Sample Preconcentration, and Pattern Recognition”, Analytical Chemistry, vol. 65, No. 14, pp. 1868-1881, (1993).
Han, C. et al., “Micromachined Piezoelectric Ultrasonic Transducers Based on Parylene Diaphragm in Silicon Substrate,” 2000 IEEE Ultrasonics Symposium, vol. 1, 22-25, pp. 919-923, (2000).
Hart, Darren J., et al., “The salt dependence of DNA recognition by Nf-KB p50: a detailed kinetic analysis of the effects on affinity and specificity.” Nucleic Acids Research, vol. 27, No. 4, pp. 1063-1069, (1999).
Houseman, Benjamin T., et al., “Peptide chips for the quantitative evaluation of protein kinase activity.” Nature Biotechnology, vol. 20, pp. 270-274, (2002).
Huston, James S. et al. “Protein Engineering of Antibody Binding Sites: Recovery of Specific Activity in an Anti-Digoxin Single-Chain Fv Analogue Produced inEscherichia coli.” Proceedings of the National Academy of Sciences of the United States of America, vol. 85, No. 16, pp. 5879-5883, (1988).
Jaafar, Maha A. S. and Denton, D. D., “A Plated Through-Hole Interconnect Technology in Silicon.” Journal of Electrochemical Society, vol. 144, No. 7, pp. 2490-2495, (1997).
Jain, M.K., et al., “Measurement of Temperature and Liquid Viscosity Using Wireless Magneto-Acoustic/MagnetoOptical Sensors,” IEEE Transactions on Magnetics, vol. 37, No. 4, pp. 2767-2769, (2001).
Kim, S. et al., “The Fabrication of Thin-Film Bulk Acoustic Wave Resonators Employing a ZNO/Si Composite Diaphragm Structure Using Porous Silicon Layer Etching,” IEEE Electron Device Letters, vol. 20, pp. 113-115, (1999).
Kleimann, P. et al., “Formation of wide and deep pores in silicon by electrochemical etching.” Materials Science and Engineering B69-70, pp. 29-33, (2000).
I. Ladabaum et al., “Surface Micromachined Capacitive Ultrasonic Transducers,” IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, vol. 45, No. 3, pp. 678-690, (1998).
Lal, Sean. P., “Antibody arrays: an embryonic but rapidly growing technology.” DDT, vol. 7, No. 18 (Suppl.), pp. S143-S149, (2002).
Lebouitz, Kyle S. et al.
Bellew Colby
Collins Boyce E.
Liu Kelvin
Banks Derris H
BioScale, Inc.
Nguyen Tai
Proskauer Rose LLP
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