Method of making thin film transistor with zinc oxide based...

Semiconductor device manufacturing: process – Having metal oxide or copper sulfide compound semiconductor...

Reexamination Certificate

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C438S151000, C438S482000, C438S483000

Reexamination Certificate

active

07981720

ABSTRACT:
According to a method of fabricating an oxide thin-film transistor, when a thin-film transistor is fabricated by using an amorphous zinc oxide (ZnO)-based semiconductor as an active layer, it may be possible to reduce a tact time as well as attain an enhanced element characteristic by depositing an insulation layer having an oxide characteristic in-situ through controlling oxygen (O2) flow subsequent to depositing an oxide semiconductor using a sputter, and the method may include the steps of forming a gate electrode on a substrate; forming a gate insulation layer on the substrate; depositing an amorphous zinc oxide-based semiconductor layer made of an amorphous zinc oxide-based semiconductor and an amorphous zinc oxide-based insulation layer having an oxide characteristic in-situ on the gate insulation layer; forming an active layer made of the amorphous zinc oxide-based semiconductor over the gate electrode while at the same time forming a channel protection layer made of the amorphous zinc oxide-based insulation layer on a channel region of the active layer; and forming a source electrode and a drain electrode electrically connected to a source region and a drain region of the active layer over the active layer.

REFERENCES:
patent: 2006/0244107 (2006-11-01), Sugihara et al.
patent: 2007/0252147 (2007-11-01), Kim et al.
patent: 2007/0272922 (2007-11-01), Kim et al.
patent: 2008/0032444 (2008-02-01), Wu et al.
patent: 2008/0258141 (2008-10-01), Park et al.
patent: 2010/0019239 (2010-01-01), Cheong et al.
patent: 2010/0084649 (2010-04-01), Seo et al.
patent: 2010/0308324 (2010-12-01), Kim et al.

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