Method of making thin film laminate printed circuit

Metal working – Method of mechanical manufacture – Electrical device making

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29840, 29843, 29848, 156155, 156182, 156241, 156247, 156631, 156902, H05K 300, B32B 3100

Patent

active

050740350

ABSTRACT:
Method of making a multilayer printed circuit including one or more thin film laminates having a circuit etched thereon without tearing, bending, or wrinkling the laminate during fabrication and which allows the use of standard multilayer etching and registration processes. The method involves the application of a low melting point plastic adhesive to a temporary backing for adhering a thin film laminate to the backing for etching and registration. A high melting point adhesive is then used to laminate an inner layer assembly to the thin film laminate/temporary backing assembly and the temporary backing removed by heating to the melting point of the plastic adhesive. The method can be used to make multilayer printed circuits or a circuit for a blasting cap for initiating the explosion of a secondary explosive.

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Tucker, T. J. and P. L. Stanton, Electrical Gurney: "A New Concept in Modeling of Energy Transfer from Electrically Exploded Conductors," Sandia Laboratories SAND 75-0244 (1975).
Schwarz, A. C., "A New Technique for Characterizing an Explosive for Shock Initiation Sensitivity", Sandia Laboratories, SAND 75-0314 (1975).
Brochure entitled "Exploding Foil Initiator Ordnance", Reynolds Industries System Inc. (San Ramon, CA), p. 4 (1985).
Kirk-Othmer Encyclopedia of Chemical Technology, 3d ed., vol. 21, p. 345, 1983.
Harper, C. A. ed., Handbook of Wiring, Cabling, and Interconnecting for Electronics, p.1-41, 1972.

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