Method of making thick film gold conductor

Details Method of making thick film gold conductor Method of making thick film gold conductor

1990-09-20

1991-08-13

Beck, Shrive

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

4271263, 4271265, 427117, C23C 2400

Patent

active

050395521

ABSTRACT:
An improved method for producing a gold conductor on a substrate in the manufacture of a thick film hybrid circuit, such that the gold conductor is suitable for wire bonding. The method comprises screen printing a fluxless gold paste on the substrate, and then firing the substrate and paste. The paste includes the resinate of a metal that can form an alloy with gold and that can also form an oxide at the firing temperature. Suitable gold pastes include bismuth and cadmium resinates in a total amount by weight of less than 1%.

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Dietrich E. Riemer "Thick Film Conductors Without Glass or Oxide Binders for Improved Wire Bonding in Multilayer Circuits" ISHM Proc. 1979, pp. 143-147.
Dietrich E. Riemer, "High-Adhesion Thick-Film Gold Without Glass or Metal-Oxide Powder Additives", IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. CHMT-8, No. 4, Dec. 1985.

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