Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Patent
1995-11-13
1997-05-06
Trinh, Michael
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
438458, 438 55, 438 51, 438466, H01L 2177
Patent
active
056271123
ABSTRACT:
A suspended microstructure process assembly includes a first microstructure assembly, with a temporary substrate having a first surface and a first microstructure fabricated on the first surface; a second microstructure assembly, including a final substrate having a second surface and a second microstructure fabricated on the second surface; connecting elements for joining the first microstructure assembly to the second microstructure assembly with a predetermined separation and alignment; and a removable bond temporarily securing the first microstructure assembly to the second microstructure assembly until the temporary substrate is removed. The connecting elements may be electrically conductive contacts or electrically nonconductive spacers. Electrically conductive contacts may be supplied to the first microstructure from a back side of the first microstructure assembly. The first microstructure fabricated on the first surface may incorporate a removable layer to enable multiple level suspended structures.
REFERENCES:
patent: 4426758 (1984-01-01), Black et al.
patent: 4847500 (1989-07-01), Pedder
patent: 4859629 (1989-08-01), Reardon et al.
patent: 5018256 (1991-05-01), Hornbeck
patent: 5037779 (1991-08-01), Whalley et al.
patent: 5045503 (1991-09-01), Kobiki et al.
patent: 5059556 (1991-10-01), Wilcoxen
patent: 5090819 (1992-02-01), Kapitulnik
patent: 5099120 (1992-03-01), Turnbull
patent: 5258325 (1993-11-01), Spitzer et al.
patent: 5438875 (1995-08-01), Fung et al.
patent: 5508231 (1996-04-01), Ball et al.
Gergis Isoris S.
Seabury Charles W.
Tennant William E.
Deinken John J.
Montanye George A.
O'Shaughnessy James P.
Rockwell International Corporation
Trinh Michael
LandOfFree
Method of making suspended microstructures does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of making suspended microstructures, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making suspended microstructures will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2132335