Method of making super conducting bonds for thin film devices

Details Method of making super conducting bonds for thin film devices Method of making super conducting bonds for thin film devices

1994-10-26

1997-01-14

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29842, 29843, 174 94R, 505927, H01L 3924

Patent

active

055927327

ABSTRACT:
An electrical connection between first and second members of superconductive material, such as niobium, is made by coating each member with an indium-lead-tin alloy solder. Each member is coated by initially applying a layer of either an indium-lead alloy or indium to a surface of the member. Then the surface is mechanically worked to break up any oxide coating that is underneath the applied layer. Next a lead-tin alloy or tin is alloyed with the applied layer to form a resultant surface layer of a indium-lead-tin alloy. The first and second members are placed in contact with each other and their respective surface layers of the indium-lead-tin alloy are melted to produce a bond therebetween. A bond form by this method also is described.

REFERENCES:
patent: 3346351 (1967-10-01), Flashman
patent: 3352008 (1967-11-01), Fairbanks
patent: 3905839 (1975-09-01), Hashimoto
patent: 4631808 (1986-12-01), Jones
patent: 5110034 (1992-05-01), Simmonds
Bi-In Equilibrium Phase Diagram.
In-Pb Equilibrium Phase Diagram.
In-Sn Equilibrium Phase Diagram.

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