Method of making substrate member having electrical lines and ap

Details Method of making substrate member having electrical lines and ap Method of making substrate member having electrical lines and ap

1994-05-23

1996-05-21

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29846, 174253, 174254, H05K 302

Patent

active

055177565

ABSTRACT:
In a substrate member (e.g., circuit board), a plurality of openings (15) are formed in an insulating film (14) which covers electric lines (12) formed on a substrate 11, with pad constructing (contacting) portions (13) of selected ones of the electric lines being exposed. In one example, the pad constructing portion (that portion of the pad to which final connection is to occur, e.g., by solder to a semiconductor device), is set to a first dimension (e.g., length) having a dimension less than a corresponding dimension of the original length. The film openings are also set to another dimension having an allowance size larger than a corresponding dimension of the pad constructing portion. The opening is thus of sufficiently large size in comparison to the respective pad being exposed so as to assure effective tolerance compensation for film positioning deviations in at least two (e.g., X and Y) directions as might occur during production of the substrate member.

REFERENCES:
patent: 4345119 (1982-08-01), Latasiewicz
patent: 4764644 (1988-08-01), Reisman et al.
patent: 5025348 (1991-06-01), Suzuki et al.
"Application of Precision Solder Volumes to Surface Pads", IBM Technical Disclosure, vol. 31, No. 11, Apr. 1990, p. 38.
"Method of Joining IC Chip Lead", EPO Publication No. JP1135093, Abstract vol. 013386, Mar. 26, 1989, Suzuki Satoshi et al.
"Printed Wiring Board", EPO Publication No. JP1094696, Abstract vol. 013330, Apr. 13, 1989, Nakai toru et al.

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