Method of making solderable printed circuits formed without plat

Details Method of making solderable printed circuits formed without plat Method of making solderable printed circuits formed without plat

1988-07-01

1991-09-03

Gallagher, John J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156330, 252511, 252514, 29829, 174257, H05K 109

Patent

active

050451413

ABSTRACT:
Described herein is a composite structure comprising a dielectric substrate surface with an electrically conductive layer or pathway thereon. The pathway comprises a thermoset resin and sufficient electrically conductive metal, in the configuration of an electric circuit element, to provide desired properties and direct solderability. Direct solderability is achieved without plating the electric circuit element. It has a low surface resistivity, preferably less than 10 m ohm per square. Also described are conductive, thixotropic inks for printed circuit devices which include silver powder and silver flake in its composition. A thixotropic adhesive for bonding the electric circuit element to the dielectric substrate surface is also taught. A method for making the composite structure is further disclosed.

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