Metal fusion bonding – Process – Preplacing solid filler
Patent
1994-01-14
1995-01-03
Heinrich, Samuel M.
Metal fusion bonding
Process
Preplacing solid filler
228219, 22818022, 222590, 427123, B23K 120, H05K 334
Patent
active
053779029
ABSTRACT:
Solder interconnection arrays for joining a plurality of metallic surfaces located on a first surface to a plurality of metallic surfaces located on a second surface are provided which reduce the amount of stress on particular areas of the interconnect array caused by shear forces between the surfaces. The arrays are formed by positioning and maintaining the first surface in a controlled environment; aligning a device for ejecting drops of liquid solder which can be varied in volume from drop to drop to deliver ejected drops of liquid solder to an initial location on the first surface; providing relative movement between the first surface and the ejection device through a predetermined sequence of locations; activating the ejection device to cause a predetermined number of drops of liquid solder of predetermined volume to be ejected and delivered to locations on the first surface predetermined locations to form solid solder deposits which vary in diameter and height from the metallic surfaces in accordance with a predetermined pattern.
REFERENCES:
patent: 3916042 (1975-10-01), Grietens
patent: 4934309 (1990-06-01), Ledermann et al.
patent: 4942984 (1990-07-01), Miller
patent: 5193738 (1993-03-01), Hayes
patent: 5229016 (1993-07-01), Hayes et al.
Heinrich Samuel M.
Kanz Jack A.
MicroFab Technologies Inc.
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