Method of making slack free wire interconnections

Details Method of making slack free wire interconnections Method of making slack free wire interconnections

1980-01-03

1982-05-04

Baldwin, Robert D.

Metal fusion bonding

Process

Plural joints

228 45, B23K 3102, H01L 2190, H05K 334

Patent

active

043278604

ABSTRACT:
Electrodes and lead-out terminals of semiconductor devices employ fine wire interconnections which require forming into a predetermined configuration. The method of the present invention provides several novel steps in a sequence of steps which causes the interconnection wire to be shaped in an extremely desirable configuration free of slack. The method is characterized by first preforming a portion of the wire in a direction opposite the direction of the desired interconnection and subsequently reforming the preformed portion of wire while the remainder of the interconnection wire is being formed in tension.

REFERENCES:
patent: 3641660 (1972-02-01), Adams et al.
patent: 4213556 (1980-07-01), Persson et al.

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