Method of making severable conductive path in an integrated-circ

Details Method of making severable conductive path in an integrated-circ Method of making severable conductive path in an integrated-circ

1991-09-06

1993-02-09

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437170, 437189, 437203, 437922, 148DIG55, H01L 2126

Patent

active

051852918

ABSTRACT:
Integrated-circuit devices are provided with conductive paths or links which, by laser irradiation or electric current pulsing, can be severed or fused. In the interest of ease of fusing, preferred links have locally reduced thickness as achieved, e.g., by employing two steps of layer deposition and etching as follows: first, a layer of conductor material is deposited on a dielectric surface, and locally reduced in thickness by etching at one or several points selected for fusing, and, second, a further layer of conductor material is deposited, and then etched to produce a desired conductive path passing through such points.

REFERENCES:
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patent: 3740523 (1973-06-01), Cohen et al.
patent: 4124899 (1978-11-01), Birkner et al.
patent: 4875971 (1989-10-01), Orbach et al.
patent: 4900695 (1990-02-01), Takahashi et al.
patent: 5026664 (1991-06-01), Hongo et al.

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