Method of making semiconductor package with segmented lead frame

Details Method of making semiconductor package with segmented lead frame Method of making semiconductor package with segmented lead frame

1993-01-04

1993-11-23

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

174 524, 437209, H01R 4300

Patent

active

052632423

ABSTRACT:
An improved semiconductor package (10) having a segmented lead frame (14) and (514) is disclosed. The preferred segmented lead frame (14) is divided into essentially identical segments (27) which have planes (22) attached to at least some of the associated individual leads (28). Segmentation of the lead frame (14) allows for the use of planes in inexpensive plastic and ceramic packages. Segmentation further allows the use of inexpensive aluminized stripes (42) to aluminize portions of individual leads (28) even in quad package configurations. An alternate equally preferred segmented lead frame (514) is provided for those applications wherein asymmetrical lead frames are required. Segmentation of the alternate segmented lead frame (514) permits the use of planes (522) and (552), while also limiting the cost of producing the alternate lead frame (514) especially when the etching method of production is required.

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patent: 4568796 (1986-02-01), Lebailly et al.
patent: 5014418 (1991-05-01), Wright

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