Method of making semiconductor package with plated connection

Details Method of making semiconductor package with plated connection Method of making semiconductor package with plated connection

2011-03-01

2011-03-01

Nguyen, Khiem D (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

C438S127000, C438S612000, C257S690000, C257S693000, C257SE21511

Reexamination Certificate

active

07897438

ABSTRACT:
A semiconductor package and method for making a semiconductor package are disclosed. The semiconductor package has a top surface and a mounting surface and includes a die, a conducting connecting material, a plating material and an insulating material. The die has a processed surface facing towards the mounting surface of the semiconductor package. Exposed metal connections are at the processed surface of the die. The conducting connecting material is disposed on the exposed metal connections. The plating material is in contact with the conducting connecting material. The insulating material is formed around the conducting connecting material, and the plating material extends to the exterior of the insulating material.

REFERENCES:
patent: 6365432 (2002-04-01), Fukutomi et al.
patent: 6667557 (2003-12-01), Alcoe et al.
patent: 6774466 (2004-08-01), Kajiwara et al.
patent: 6927096 (2005-08-01), Shimanuki

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