Method of making semiconductor package

Details Method of making semiconductor package Method of making semiconductor package

1995-05-22

1996-07-02

Picardat, Kevin M.

Fishing, trapping, and vermin destroying

437211, 437214, 437217, 437219, H01L 2160

Patent

active

055321895

ABSTRACT:
A semiconductor integrated circuit device and method of making same wherein recessed bus bar regions are provided in an elongated bus bar to accommodate location of bonding wires which couple the device's chip pads and associated inner leads. Fillets are formed of insulative adhesive material (from the tape used to secure the leads and bus bar to the chip) up about the bus bar region sides to thereby engage the bonding wires to prevent contact between the wires and bus bar.

REFERENCES:
patent: 5229329 (1993-07-01), Chai et al.
patent: 5278101 (1994-01-01), Ikenoue
patent: 5304842 (1994-04-01), Farnworth et al.
patent: 5334803 (1994-08-01), Yamamura et al.
patent: 5352633 (1994-10-01), Abbott
patent: 5357139 (1994-10-01), Yaguchi et al.
patent: 5358904 (1994-10-01), Murakami et al.
patent: 5428247 (1995-06-01), Sohn et al.
IBM Technical Disclosure Bulletin, vol. 34, No. 1, Jun. 1991, "Thin Small Outline Packages", E. J. Dombroski et al., pp. 358-359.

Affiliated with

Also associated with

Rating

Method of making semiconductor package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of making semiconductor package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making semiconductor package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1506277