Method of making semiconductor integrated circuit, pattern detec

Optics: measuring and testing – By alignment in lateral direction – With registration indicia

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G03F 900, H01L 2130

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052607712

ABSTRACT:
According to the present invention, in making alignment between a semiconductor integrated circuit wafer and a mask or a reticle in light exposure of the wafer with a monochromatic light such as g-, i- or h-line of a mercury lamp, using a reduced stepping exposure system, light from a predetermined pattern on the wafer is taken out to an off-axis position and observed according to a through-the-lens method; in this case as a characteristic feature of the invention, the, observation light is taken out from below the reticle and is passed through chromatic aberration correcting lenses, thereby permitting the use of a polychromatic or continuous spectrum light.

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Jacobs, Donald H. Fundamentals of Optical Engineering, McGraw-Hill Book Company, New York. copyright 1943.

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